CC-BY-NC-NDBalanović, LjubišaManasijević, DraganMarković, IvanaStamenković, UrošPetrić, Marijana2024-01-172024-01-172023978-86-6305-137-9https://eco.tfbor.bg.ac.rs/download/Zbornici/2023.pdfhttps://repozitorijum.tfbor.bg.ac.rs/handle/123456789/5801Bi-Sb-Sn alloys have gained attention as potential replacements for lead-tin (Pb-Sn) alloys due to their desirable properties and reduced environmental impact. These alloys offer a combination of low toxicity, low melting point, good solder ability, and mechanical strength, making them suitable for various applications in electronics and soldering. This work carried out the microstructural and thermal characterization of three-component alloys from the Bi-Sb-Sn system. Microstructural characterization of lead-free solder is essential as it provides crucial insights into the composition, distribution, and morphology of phases within the solder material. Thermal characterization of Bi-Sb-Sn alloys involves evaluating their thermal properties, including thermal diffusivity, specific heat capacity, and thermal conductivity. These properties play a crucial role in determining the performance and suitability of these alloys for various applications. Ongoing research and development in this field are expected to uncover further ecological applications for these alloys.enBi-Sb-Snlead-free soldermicrostructural characterizationthermal diffusivityconferenceObject