CC-BY-NC-NDNedeljković, MilanMladenović, SrbaĆosović, VladanMarković, IvanaPetrović, JasminaStamenković, UrošMitrović, MilijanaKovačević, Avram2025-11-252025-11-252025978-86-6305-164-510.5937/IOC25430Nhttps://ioc.tfbor.bg.ac.rs/public/2025/Proceedings_IOC_2025.pdfhttps://repozitorijum.tfbor.bg.ac.rs/handle/123456789/6015The effect of graphene nanosheets (GNS) on the wettability and microstructure of Sn-0.7Cu-xGNS (x = 0,0.02, 0.04, 0.06, 0.08, and 0.1 wt.%) nanocomposite solders was investigated. The composites were produced using the powder metallurgy (PM) technique. The microstructures of the solder joints between the solders and copper substrates were examined using a scanning electron microscope (SEM), and the presence of intermetallic compounds (IMCs) was confirmed by energy-dispersive spectroscopy (EDS). The thickness of the intermetallic layer formed at the solder/Cu interface was reduced by 64.6% with the addition of up to 0.1 wt.% GNS, compared to the Sn-0.7Cu base solder. The wettability of the samples was evaluated by measuring the spreading area of the solders on the copper substrates. The results showed that the addition of up to 0.1 wt.% GNS significantly improved wettability, as evidenced by a 95.2% increase in spreading area compared to the unreinforced solder.enpowder metallurgynanocompositegraphene nanosheetsintermetallic compoundsconferenceObject