ARRManasijević, DraganBalanović, LjubišaMarković, IvanaGorgievski, MilanStamenković, UrošBožinović, KristinaMinić, DušanPremović Zečević, Milena2023-12-262023-12-262023978-86-87183-32-2https://repozitorijum.tfbor.bg.ac.rs/handle/123456789/2456The Ag-Bi-Sn ternary alloys represent an important material for the development of lead-free solders. In this work, the effiect of tin content on the thermal properties of the Ag-Bi—Sn ternary alloys was investigated. Five Ag-Bi-Sn ternary alloys with tin content ranging from 12.8 to 75.1 mass% and nearly equal mass contents of silver and bismuth were prepared and experimentally studied. Microstructures of as-solidified alloy samples were examined using scanning electron microscopy with energy-dispersive X-ray spectrometry (SEM-EDS) and X-ray diffraction (XRD) analysis. The observed constitutive phases were AgsSn, (Sn), and (Bi) phases as well as ternary (Sn)+(Bi)+Ag;Sn eutectic. Thermal diffusivity measurements in the temperature range from 25 to 100 °C were performed using the flash method. Thermal conductivities of the solid Ag-Bi-Sn alloys were obtained using the measured values of thermal diffusivity. Thermal conductivity of the studied Ag-Bi—Sn ternary alloys considerably increases with increasing tin concentration and slightly decreases with increasing temperature. The measured thermal diffusivity at room temperature extends from 8.00 to 27.80 mm?s”! and thermal conductivity extends from 14.24 to 45.77 Wm™'K"! with increasing Sn content. Chemical and phase compositions have a strong effect on the thermal diffusivity and thermal conductivity of the studied Ag-Bi-Sn alloys. It was found that an increase in the phase fractions of the (Bi) solid solution phase and AgsSn intermetallic compound hinders heat transfer and decreases thermal conductivity.enAg-Bi-Sn alloysmicrostructurethermal conductivityconferenceObject