Microstructures and wettability behavior of Sn-0.7Cu solder doped with graphene nanosheets
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Date
2025
Authors
Nedeljković, Milan
Mladenović, Srba
Ćosović, Vladan
Marković, Ivana
Petrović, Jasmina
Stamenković, Uroš
Mitrović, Milijana
Kovačević, Avram
Journal Title
Journal ISSN
Volume Title
Publisher
University of Belgrade - Technical Faculty in Bor
Source
Proceedings [Elektronski izvor] - 56th International October Conference on Mining and Metallurgy - IOC 2025, 22-25 October, 2025, Bor Lake, Serbia
Volume
Issue
Abstract
The effect of graphene nanosheets (GNS) on the wettability and microstructure of Sn-0.7Cu-xGNS (x = 0,0.02, 0.04, 0.06, 0.08, and 0.1 wt.%) nanocomposite solders was investigated. The composites were produced using the powder metallurgy (PM) technique. The microstructures of the solder joints between the solders and copper substrates were examined using a scanning electron microscope (SEM), and the presence of intermetallic compounds (IMCs) was confirmed by energy-dispersive spectroscopy (EDS). The thickness of the intermetallic layer formed at the solder/Cu interface was reduced by 64.6% with the addition of up to 0.1 wt.% GNS, compared to the Sn-0.7Cu base solder. The wettability of the samples was evaluated by measuring the spreading area of the solders on the copper substrates. The results showed that the addition of up to 0.1 wt.% GNS significantly improved wettability, as evidenced by a 95.2% increase in
spreading area compared to the unreinforced solder.
Description
Keywords
powder metallurgy, nanocomposite, graphene nanosheets, intermetallic compounds
Citation
DOI
10.5937/IOC25430N
Scopus
ISSN
ISBN
978-86-6305-164-5
License
CC-BY-NC-ND