Microstructures and wettability behavior of Sn-0.7Cu solder doped with graphene nanosheets
Conference Object Open access M33
2025
Kovačević, Avram 
Nedeljković, Milan
Mladenović, Srba
Ćosović, Vladan
Marković, Ivana
Petrović, Jasmina
Stamenković, Uroš
Mitrović, Milijana
University of Belgrade - Technical Faculty in Bor
Proceedings [Elektronski izvor] - 56th International October Conference on Mining and Metallurgy - IOC 2025, 22-25 October, 2025, Bor Lake, Serbia
430
433
English
M33 - Conference paper at an international conference, printed in full
The effect of graphene nanosheets (GNS) on the wettability and microstructure of Sn-0.7Cu-xGNS (x = 0,0.02, 0.04, 0.06, 0.08, and 0.1 wt.%) nanocomposite solders was investigated. The composites were produced using the powder metallurgy (PM) technique. The microstructures of the solder joints between the solders and copper substrates were examined using a scanning electron microscope (SEM), and the presence of intermetallic compounds (IMCs) was confirmed by energy-dispersive spectroscopy (EDS). The thickness of the intermetallic layer formed at the solder/Cu interface was reduced by 64.6% with the addition of up to 0.1 wt.% GNS, compared to the Sn-0.7Cu base solder. The wettability of the samples was evaluated by measuring the spreading area of the solders on the copper substrates. The results showed that the addition of up to 0.1 wt.% GNS significantly improved wettability, as evidenced by a 95.2% increase in spreading area compared to the unreinforced solder.
powder metallurgy, nanocomposite, graphene nanosheets, intermetallic compounds
DOI
10.5937/IOC25430N
ISBN
978-86-6305-164-5