Influence of Cu and C particle reinforcement on the mechanical, thermal, electrical, and soldering behavior of Sn88Bi12 solder alloy

Stamenković, Uroš; Marković, Ivana; Manasijević, Dragan; Gorgievski, Milan; Nedeljković, Milan; Božinović, Kristina; Kovačević, Avram

doi:10.31577/km.2026.2.71

Article Restricted access M23

U. Stamenković et al. KM_2026.pdf (1.42MB)

2026

Stamenković, Uroš
Marković, Ivana
Manasijević, Dragan
Gorgievski, Milan
Nedeljković, Milan
Božinović, Kristina
Kovačević, Avram

Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Bratislava

Kovove Materialy - Metallic Materials

English (United States)

M23 - Paper in an international journal

The development of low-temperature, lead-free solders with balanced mechanical reliability, functional properties, and soldering performance remains a key challenge in electronic packaging. This study systematically investigates the mechanical, electrical, thermal, microstructural, and soldering behavior of pure Sn, a hypoeutectic Sn88Bi12 alloy, and two Sn88Bi12-based composites reinforced with Cu and graphite particles. The addition of 12 wt.% Bi to pure Sn resulted in pronounced grain refinement and substantial increases in microhardness and tensile strength, while further improvements were achieved through particulate reinforcement. These strengthening effects were accompanied by moderate reductions in electrical conductivity and thermal transport properties due to enhanced electron and phonon scattering. Differential scanning calorimetry showed that Bi addition effectively lowers the melting temperature of Sn, whereas Cu and graphite reinforcements broaden the melting interval without increasing the melting temperature. Soldering tests on Cu substrates revealed improved wettability of Sn88Bi12 compared to pure Sn, characterized by a lower contact angle, enhanced spreading, and reduced intermetallic compound (IMC) thickness. Although particle reinforcement slightly reduced spreading behavior, both Cu and graphite effectively suppressed IMC growth, with graphite providing the strongest inhibition.

Sn88Bi12 alloy, Cu and C composites, thermophysical properties, mechanical properties, soldering behavior

DOI

10.31577/km.2026.2.71

ISSN

0023-432X
1338-4252

URI

https://repozitorijum.tfbor.bg.ac.rs/handle/...

Scopus Web of Science OpenCitations OpenAlex

dc.creator	Stamenković, Uroš
dc.creator	Marković, Ivana
dc.creator	Manasijević, Dragan
dc.creator	Gorgievski, Milan
dc.creator	Nedeljković, Milan
dc.creator	Božinović, Kristina
dc.creator	Kovačević, Avram
dc.title	Influence of Cu and C particle reinforcement on the mechanical, thermal, electrical, and soldering behavior of Sn88Bi12 solder alloy
dc.date.issued	2026
dc.publisher	Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Bratislava
dc.identifier.issn	0023-432X
dc.identifier.issn	1338-4252
dc.identifier.doi	10.31577/km.2026.2.71
dc.type	article
dc.source	Kovove Materialy - Metallic Materials
dc.citation.volume	64
dc.citation.issue	2
dc.citation.spage	71
dc.citation.epage	83
dc.language.iso	en_US
dc.type.version	publishedVersion
dc.citation.rank	M23
dc.citation.ifactor	0.6
dc.subject	Sn88Bi12 alloy
dc.subject	Cu and C composites
dc.subject	thermophysical properties
dc.subject	mechanical properties
dc.subject	soldering behavior
dc.description.abstract	The development of low-temperature, lead-free solders with balanced mechanical reliability, functional properties, and soldering performance remains a key challenge in electronic packaging. This study systematically investigates the mechanical, electrical, thermal, microstructural, and soldering behavior of pure Sn, a hypoeutectic Sn88Bi12 alloy, and two Sn88Bi12-based composites reinforced with Cu and graphite particles. The addition of 12 wt.% Bi to pure Sn resulted in pronounced grain refinement and substantial increases in microhardness and tensile strength, while further improvements were achieved through particulate reinforcement. These strengthening effects were accompanied by moderate reductions in electrical conductivity and thermal transport properties due to enhanced electron and phonon scattering. Differential scanning calorimetry showed that Bi addition effectively lowers the melting temperature of Sn, whereas Cu and graphite reinforcements broaden the melting interval without increasing the melting temperature. Soldering tests on Cu substrates revealed improved wettability of Sn88Bi12 compared to pure Sn, characterized by a lower contact angle, enhanced spreading, and reduced intermetallic compound (IMC) thickness. Although particle reinforcement slightly reduced spreading behavior, both Cu and graphite effectively suppressed IMC growth, with graphite providing the strongest inhibition.
dc.rights.license	CC-BY-NC
dc.rights.uri	https://creativecommons.org/licenses/by-nc/4.0/
dc.date.accessioned	2026-11-02T12:35:00Z
dc.description.provenance	Submitted by ustamenkovic@tfbor.bg.ac.rs on 2026-10-21 19:47:00.21564, with 2 file(s). Approved by Милица Ницуловић (mniculovic@tfbor.bg.ac.rs) on 2026-11-02T12:35:00Z.
dc.identifier.uri	https://repozitorijum.tfbor.bg.ac.rs/handle/123456789/6157


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