The investigation of thermal properties and melting behaviour of Sn78Bi22 solder alloy

Stamenković, Uroš; Marković, Ivana; Manasijević, Dragan; Božinović, Kristina; Nedeljković, Milan; Kovačević, Avram

doi:10.5937/IOC26185S

Conference Object Open access M33

U. Stamenkovic et al. - IOC 2026.pdf (1.39MB)

2026

Stamenković, Uroš
Marković, Ivana
Manasijević, Dragan
Božinović, Kristina
Nedeljković, Milan
Kovačević, Avram

Mining and Metallurgy Institute Bor

Proceedings - 57th International October Conference on Mining and Metallurgy - IOC 2026, 05-07 October 2026, Bor Lake, Serbia

185

188

English

M33 - Conference paper at an international conference, printed in full

In the present study, the Sn78Bi22 alloy was investigated as a potential solder material. The study focused on the evaluation of thermal diffusivity and thermal conductivity over a defined temperature range, differential scanning calorimetry (DSC) analysis, and an assessment of soldering behavior through measurements of contact angle, spreading area, spreading ratio, and intermetallic compound (IMC) layer thickness. The investigated alloy exhibited reduced thermal diffusivity and thermal conductivity compared with literature data for pure Sn. DSC analysis indicated a decrease in melting temperature compared with pure Sn reported in the literature, resulting from the addition of Bi. Soldering behavior was evaluated as favorable, characterized by a thin IMC layer, a low contact angle on a Cu substrate, and high spreading ratio and spreading area. Based on these results, the Sn78Bi22 alloy shows potential for lead-free soldering applications.

Sn78Bi22, DSC analysis, thermal properties, soldering behavior

DOI

10.5937/IOC26185S

ISBN

978-86-7827-054-3

URI

https://repozitorijum.tfbor.bg.ac.rs/handle/...

Scopus Web of Science OpenCitations OpenAlex

dc.creator	Stamenković, Uroš
dc.creator	Marković, Ivana
dc.creator	Manasijević, Dragan
dc.creator	Božinović, Kristina
dc.creator	Nedeljković, Milan
dc.creator	Kovačević, Avram
dc.contributor	Kostov, Ana
dc.title	The investigation of thermal properties and melting behaviour of Sn78Bi22 solder alloy
dc.date.issued	2026
dc.publisher	Mining and Metallurgy Institute Bor
dc.identifier.doi	10.5937/IOC26185S
dc.identifier.isbn	978-86-7827-054-3
dc.type	conferenceObject
dc.source	Proceedings - 57th International October Conference on Mining and Metallurgy - IOC 2026, 05-07 October 2026, Bor Lake, Serbia
dc.citation.spage	185
dc.citation.epage	188
dc.language.iso	en
dc.type.version	publishedVersion
dc.citation.rank	M33
dc.subject	Sn78Bi22
dc.subject	DSC analysis
dc.subject	thermal properties
dc.subject	soldering behavior
dc.description.abstract	In the present study, the Sn78Bi22 alloy was investigated as a potential solder material. The study focused on the evaluation of thermal diffusivity and thermal conductivity over a defined temperature range, differential scanning calorimetry (DSC) analysis, and an assessment of soldering behavior through measurements of contact angle, spreading area, spreading ratio, and intermetallic compound (IMC) layer thickness. The investigated alloy exhibited reduced thermal diffusivity and thermal conductivity compared with literature data for pure Sn. DSC analysis indicated a decrease in melting temperature compared with pure Sn reported in the literature, resulting from the addition of Bi. Soldering behavior was evaluated as favorable, characterized by a thin IMC layer, a low contact angle on a Cu substrate, and high spreading ratio and spreading area. Based on these results, the Sn78Bi22 alloy shows potential for lead-free soldering applications.
dc.rights.license	CC-BY-NC-ND
dc.rights.uri	https://creativecommons.org/licenses/by-nc-nd/4.0/
dc.date.accessioned	2026-11-03T10:45:30Z
dc.description.provenance	Submitted by ustamenkovic@tfbor.bg.ac.rs on 2026-10-21 20:19:46.739771, with 2 file(s). Approved by Милица Ницуловић (mniculovic@tfbor.bg.ac.rs) on 2026-11-03T10:45:30Z.
dc.identifier.uri	https://repozitorijum.tfbor.bg.ac.rs/handle/123456789/6159
dc.identifier.fulltext	https://repozitorijum.tfbor.bg.ac.rs/bitstream?id=af4517ed-1aee-4b56-b331-9db60b88df8f


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