Environmental aspects and experimental investigation of SAC/GNS composite lead-free solder

Marković, Ivana; Stamenković, Uroš; Nedeljković, Milan; Manasijević, Dragan; Balanović, Ljubiša

doi:10.5937/EcoTER26422M

Conference Object Open access M33

Markovic et al. - EcoTER26.pdf (3.16MB)

2026

Marković, Ivana
Stamenković, Uroš
Nedeljković, Milan
Manasijević, Dragan
Balanović, Ljubiša

University of Belgrade - Technical Faculty in Bor

Proceedings [Elektronski izvor] - 32nd International conference Ecological Truth & Environmental Research - EcoTER'26, Sokobanja, Serbia, 24-26 June 2026

422

426

English

M33 - Conference paper at an international conference, printed in full

Ternary alloys of the Sn–Ag–Cu (SAC) system represent one of the most widely used lead-free solder materials due to their favorable mechanical properties and compliance with environmental regulations aimed at eliminating toxic lead from electronic components. Among these alloys, SAC338 (Sn–3.3Ag–0.8Cu) is recognized as one of the most promising alternatives to conventional Sn–Pb solders. Despite their ecological advantages, SAC alloys still exhibit challenges associated with the growth of intermetallic compounds and microstructural instability. The aim of this study was to investigate the influence of graphene nanosheet (GNS) additions on the microstructural properties of SAC composite. SAC composite containing up to 0.09 wt.% GNS were produced using powder metallurgy procedures. The results showed that the addition of GNS contributed to a more homogeneous microstructure and refinement of intermetallic phases such as Cu6Sn5 and Ag3Sn. The addition of GNS improves the wettability of the composite solder by reducing the wetting angle, which enables better spreading of the molten solder and improves the quality of solder joints. From an environmental perspective, these improvements contribute to enhanced durability and longer service life of electronic components, leading to reduced material consumption, lower maintenance frequency, and decreased generation of electronic waste.

451-03- 34/2026-03/ 200131

SAC338, GNS, intermetallic phases, wettability

DOI

10.5937/EcoTER26422M

ISBN

978-86-6305-171-3

URI

https://repozitorijum.tfbor.bg.ac.rs/handle/...

Scopus Web of Science OpenCitations OpenAlex

dc.creator	Marković, Ivana
dc.creator	Stamenković, Uroš
dc.creator	Nedeljković, Milan
dc.creator	Manasijević, Dragan
dc.creator	Balanović, Ljubiša
dc.contributor	Radojević, Ana
dc.title	Environmental aspects and experimental investigation of SAC/GNS composite lead-free solder
dc.date.issued	2026
dc.publisher	University of Belgrade - Technical Faculty in Bor
dc.identifier.doi	10.5937/EcoTER26422M
dc.identifier.isbn	978-86-6305-171-3
dc.type	conferenceObject
dc.source	Proceedings [Elektronski izvor] - 32nd International conference Ecological Truth & Environmental Research - EcoTER'26, Sokobanja, Serbia, 24-26 June 2026
dc.citation.spage	422
dc.citation.epage	426
dc.language.iso	en
dc.type.version	publishedVersion
dc.citation.rank	M33
dc.subject	SAC338
dc.subject	GNS
dc.subject	intermetallic phases
dc.subject	wettability
dc.description.abstract	Ternary alloys of the Sn–Ag–Cu (SAC) system represent one of the most widely used lead-free solder materials due to their favorable mechanical properties and compliance with environmental regulations aimed at eliminating toxic lead from electronic components. Among these alloys, SAC338 (Sn–3.3Ag–0.8Cu) is recognized as one of the most promising alternatives to conventional Sn–Pb solders. Despite their ecological advantages, SAC alloys still exhibit challenges associated with the growth of intermetallic compounds and microstructural instability. The aim of this study was to investigate the influence of graphene nanosheet (GNS) additions on the microstructural properties of SAC composite. SAC composite containing up to 0.09 wt.% GNS were produced using powder metallurgy procedures. The results showed that the addition of GNS contributed to a more homogeneous microstructure and refinement of intermetallic phases such as Cu6Sn5 and Ag3Sn. The addition of GNS improves the wettability of the composite solder by reducing the wetting angle, which enables better spreading of the molten solder and improves the quality of solder joints. From an environmental perspective, these improvements contribute to enhanced durability and longer service life of electronic components, leading to reduced material consumption, lower maintenance frequency, and decreased generation of electronic waste.
dc.relation	451-03- 34/2026-03/ 200131
dc.rights.license	CC-BY-NC-ND
dc.rights.uri	https://creativecommons.org/licenses/by-nc-nd/4.0/
dc.date.accessioned	2026-10-29T11:48:48Z
dc.description.provenance	Submitted by imarkovic@tfbor.bg.ac.rs on 2026-10-22 06:59:01.218012, with 2 file(s). Approved by Милица Ницуловић (mniculovic@tfbor.bg.ac.rs) on 2026-10-29T11:48:48Z.
dc.identifier.uri	https://repozitorijum.tfbor.bg.ac.rs/handle/123456789/6162
dc.identifier.fulltext	https://repozitorijum.tfbor.bg.ac.rs/bitstream?id=2dccd87b-e5cf-470f-9816-61ff09154513


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