Microstructural and thermal characterization of Bi-Sb-Sn alloys for ecological application

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dc.citation.epage493
dc.citation.rankM33
dc.citation.spage488
dc.contributor.authorBalanović, Ljubiša
dc.contributor.authorManasijević, Dragan
dc.contributor.authorMarković, Ivana
dc.contributor.authorStamenković, Uroš
dc.contributor.authorPetrić, Marijana
dc.date.accessioned2024-01-17T10:05:30Z
dc.date.available2024-01-17T10:05:30Z
dc.date.issued2023
dc.description.abstractBi-Sb-Sn alloys have gained attention as potential replacements for lead-tin (Pb-Sn) alloys due to their desirable properties and reduced environmental impact. These alloys offer a combination of low toxicity, low melting point, good solder ability, and mechanical strength, making them suitable for various applications in electronics and soldering. This work carried out the microstructural and thermal characterization of three-component alloys from the Bi-Sb-Sn system. Microstructural characterization of lead-free solder is essential as it provides crucial insights into the composition, distribution, and morphology of phases within the solder material. Thermal characterization of Bi-Sb-Sn alloys involves evaluating their thermal properties, including thermal diffusivity, specific heat capacity, and thermal conductivity. These properties play a crucial role in determining the performance and suitability of these alloys for various applications. Ongoing research and development in this field are expected to uncover further ecological applications for these alloys.
dc.identifier.isbn978-86-6305-137-9
dc.identifier.urihttps://eco.tfbor.bg.ac.rs/download/Zbornici/2023.pdf
dc.identifier.urihttps://repozitorijum.tfbor.bg.ac.rs/handle/123456789/5801
dc.language.isoen
dc.publisherUniversity of Belgrade, Technical Faculty in Bor
dc.rights.licenseCC-BY-NC-ND
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/4.0/
dc.sourceProceedings - 30th International Conference Ecological Truth & Environmental Research - EcoTER'23, 20-23 June 2023, Serbia, 2023, 488-493
dc.subjectBi-Sb-Sn
dc.subjectlead-free solder
dc.subjectmicrostructural characterization
dc.subjectthermal diffusivity
dc.titleMicrostructural and thermal characterization of Bi-Sb-Sn alloys for ecological application
dc.typeconferenceObject
dc.type.versionpublishedVersion

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