Bi–In–Sn Lead-free solders: Microstructure and thermal conductivity

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dc.citation.epage32
dc.citation.rankM64
dc.citation.spage30
dc.contributor.authorBalanović, Ljubiša
dc.contributor.authorManasijević, Dragan
dc.contributor.authorMarković, Ivana
dc.contributor.authorGorgievski, Milan
dc.contributor.authorStamenković, Uroš
dc.date.accessioned2024-08-07T08:14:28Z
dc.date.available2024-08-07T08:14:28Z
dc.date.issued2023
dc.description.abstractIn the paper, the focus was on the microstructure and thermal conductivity of three component lead-free solder alloys of Bi-In-Sn system. Microstructural characterization involved the examination of the microstructure of the alloys using scanning electron microscopy (TESCAN VEGA 3 LMU) and the compositions of the coexisting phases, as well as the total composition of the prepared alloys with energy-dispersive X-ray spectrometry (Oxford Instruments X-act). The microstructural analysis helped to determine the presence of intermetallic compounds, grain boundaries, and other features that influence the material's properties and performance. Furthermore, the thermal characterization of the Bi-In-Sn alloys involved the evaluation of their thermal properties, including thermal diffusivity, thermal conductivity, and heat capacity. These properties are essential for understanding the alloys' heat transfer behavior, their ability to dissipate heat, and their suitability for specific applications in which thermal management is crucial. Thermal diffusivity was measured using a flash method using Discovery Xenon Flash (DXF) 500 instrument (TA Instruments, Germany). Other thermal properties like thermal conductivity and heat capacity are evaluated to provide a comprehensive understanding of the alloys' thermal behavior. These properties determine the alloys' ability to conduct heat and store thermal energy. The microstructural and thermal characterization combination provides valuable information about the Bi-In-Sn lead-free solder alloys. The results of this study contribute to the knowledge base on Bi-In-Sn lead-free solder alloys and can guide future research and development efforts in this field.
dc.identifier.isbn978-86-81656-63-1
dc.identifier.urihttps://repozitorijum.tfbor.bg.ac.rs/handle/123456789/5846
dc.language.isoen
dc.publisherFakultet Tehničkih nauka, Kosovska Mitrovica
dc.rights.licenseARR
dc.rights.uriAll rights reserved
dc.sourceZbornik izvoda radova - Jedanaesti simpozijum o termodinamici i faznim dijagramima sa međunarodnim učešćem, Kosovska Mitrovica, 23-24. jun 2023, 2023, 30-32
dc.titleBi–In–Sn Lead-free solders: Microstructure and thermal conductivity
dc.typeconferenceObject
dc.type.versionpublishedVersion

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