Electrodeposition of copper on cold rolled copper substrate

dc.citation.epage105
dc.citation.rankM31
dc.citation.spage102
dc.contributor.authorGusković, Dragoslav
dc.contributor.authorMarjanović, Saša
dc.contributor.authorIvanov, Svetlana
dc.contributor.authorRajčić-Vujasinović, Mirjana
dc.date.accessioned2023-12-26T09:40:16Z
dc.date.available2023-12-26T09:40:16Z
dc.date.issued2020
dc.description.abstractabstract
dc.identifier.isbn2535-0021 (PRINT); 2535-003X (ONLINE)
dc.identifier.urihttps://repozitorijum.tfbor.bg.ac.rs/handle/123456789/2804
dc.language.isoen
dc.publisherSCIENTIFIC TECHNICAL UNION OF MECHANICAL ENGINEERING - INDUSTRY 4.0 BULGARIA
dc.rights.licenseCC-BY-NC-ND
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/4.0/
dc.sourceProceedings
dc.titleElectrodeposition of copper on cold rolled copper substrate
dc.typeconferenceObject
dc.type.versionpublishedVersion

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