Protection of copper surface in acidic chloride solution by non-toxic thiadiazole derivative
dc.citation.epage | 387 | |
dc.citation.issue | 4 | |
dc.citation.rank | M23 | |
dc.citation.spage | 369 | |
dc.citation.volume | 31 | |
dc.contributor.author | Radovanović, Milan | |
dc.contributor.author | Antonijević, Milan | |
dc.date.accessioned | 2023-12-25T22:16:08Z | |
dc.date.available | 2023-12-25T22:16:08Z | |
dc.date.issued | 2017 | |
dc.identifier.issn | 0169-4243 | |
dc.identifier.uri | http://www.tandfonline.com/doi/pdf/10.1080/01694243.2016.1215764 | |
dc.identifier.uri | https://repozitorijum.tfbor.bg.ac.rs/handle/123456789/1281 | |
dc.language.iso | en | |
dc.rights.license | ARR | |
dc.rights.uri | https://en.wikipedia.org/wiki/All_rights_reserved | |
dc.source | JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY | |
dc.title | Protection of copper surface in acidic chloride solution by non-toxic thiadiazole derivative | |
dc.type | article | |
dc.type.version | publishedVersion |