Thermal and microstructural analysis of the low-melting Bi–In–Sn ternary alloys
Conference Object Open access M33
2023
Balanović, Ljubiša 
Manasijević, Dragan
Marković, Ivana
Gorgievski, Milan
Stamenković, Uroš
Milkić, Dajana
University of Zenica, Faculty of Metallurgy and Technology
Proceedings - 14th Scientific-Research Symposium with International Participation - Metallic and nonmetallic materials : production - properties - application, Zenica, Bosnia and Herzegovina, 27th-28th April 2023, 2023, 73-82
14
73
82
English
M33 - Conference paper at an international conference, printed in full
Low-melting alloys, based on bismuth, indium, and tin, have found commercial use in soldering, safety devices, coatings, and bonding applications, due to their low melting point temperature of eutectic compositions and small differences between their liquidus and solidus temperatures. Based on this, the accurate knowledge of their thermal properties such as melting and solidification temperatures, latent heat of melting, supercooling tendency, etc. is of immense importance. In the present research, low-melting alloy from three cross-sections Bi-Sn50In50, Sn-In50Bi50, and In-Bi50Sn50 (wt.%) was investigated using differential thermal analysis (DTA), and by scanning electron microscopy (SEM) with energy dispersive spectrometry (EDS). Temperatures of phase transformations, determined by DTA, and phase compositions of coexisting phases, determined by EDS analysis, were found to support the corresponding calculated phase compositions quite well. The experimentally obtained results were compared with the results of thermodynamic calculation according to the CALPHAD approach, and a close agreement was noticed.
Bi-In-Sn alloys, differential thermal analysis (DTA), microstructure, SEM-EDS
ISSN
2566-4344