Impact of the GNS particles on the microstructure and thermal properties OF Sn-0.7Cu solder alloys
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Date
2024
Authors
Nedeljković, Milan
Mladenović, Srba
Petrović, Jasmina
Stamenković, Uroš
Mitrović, Milijana
Journal Title
Journal ISSN
Volume Title
Publisher
Mining and Metallurgy Institute Bor
Source
Proceedings - 55th International October Conference on Mining and Metallurgy - IOC 2024, 15-17 October 2024, Kladovo, Serbia
Volume
Issue
Abstract
The development of various types of so-called "environmentally friendly" solders has been extensively investigated worldwide as an alternative to lead-based solders. This study investigated the influence of graphene nanoparticles on the microstructure and thermal properties of lead-free solders. Nanocomposite solders were produced using the powder metallurgy method. Graphene nanoparticles were used as reinforcement in the form of graphene nanosheets (GNS). Microstructural analysis showed that the GNS particles were homogeneously distributed along the grain boundaries, resulting in a refined β-Sn structure. At room temperature, density was measured using the Archimedes method, while thermal diffusivity was determined using the flash method. The thermal conductivity of the Sn-0.7Cu nanocomposite solders was calculated using a fundamental equation. Increasing the GNS content up to 0.08 wt% in the Sn-0.7Cu solder matrix led to a slight decrease in the density of the nanocomposite solders compared to the base solder, while the highest thermal conductivity was achieved with a 0.05 wt% GNS addition, reaching 44.74 Wm⁻¹ K⁻¹.
Description
Keywords
Lead-free solder alloys, powder metallurgy, graphene nanosheets
Citation
DOI
10.5937/IOC24295N
Scopus
ISSN
ISBN
978-86-7827-053-6
License
CC-BY-NC-ND