Impact of the GNS particles on the microstructure and thermal properties OF Sn-0.7Cu solder alloys

Simple item page
dc.citation.epage300
dc.citation.rankM33
dc.citation.spage295
dc.contributor.authorNedeljković, Milan
dc.contributor.authorMladenović, Srba
dc.contributor.authorPetrović, Jasmina
dc.contributor.authorStamenković, Uroš
dc.contributor.authorMitrović, Milijana
dc.date.accessioned2024-12-12T11:55:02Z
dc.date.available2024-12-12T11:55:02Z
dc.date.issued2024
dc.description.abstractThe development of various types of so-called "environmentally friendly" solders has been extensively investigated worldwide as an alternative to lead-based solders. This study investigated the influence of graphene nanoparticles on the microstructure and thermal properties of lead-free solders. Nanocomposite solders were produced using the powder metallurgy method. Graphene nanoparticles were used as reinforcement in the form of graphene nanosheets (GNS). Microstructural analysis showed that the GNS particles were homogeneously distributed along the grain boundaries, resulting in a refined β-Sn structure. At room temperature, density was measured using the Archimedes method, while thermal diffusivity was determined using the flash method. The thermal conductivity of the Sn-0.7Cu nanocomposite solders was calculated using a fundamental equation. Increasing the GNS content up to 0.08 wt% in the Sn-0.7Cu solder matrix led to a slight decrease in the density of the nanocomposite solders compared to the base solder, while the highest thermal conductivity was achieved with a 0.05 wt% GNS addition, reaching 44.74 Wm⁻¹ K⁻¹.
dc.description.sponsorshipThe research presented in this paper was done with the financial support of the Ministry of Science, Technological Development and Innovation of the Republic of Serbia, with the funding of the scientific research work at the University of Belgrade, Technical Faculty in Bor, according to the contract with registration number 451-03-65/2024-03/200131.
dc.identifier.doi10.5937/IOC24295N
dc.identifier.isbn978-86-7827-053-6
dc.identifier.urihttps://repozitorijum.tfbor.bg.ac.rs/handle/123456789/5908
dc.language.isoen
dc.publisherMining and Metallurgy Institute Bor
dc.rights.licenseCC-BY-NC-ND
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/4.0/
dc.sourceProceedings - 55th International October Conference on Mining and Metallurgy - IOC 2024, 15-17 October 2024, Kladovo, Serbia
dc.subjectLead-free solder alloys
dc.subjectpowder metallurgy
dc.subjectgraphene nanosheets
dc.titleImpact of the GNS particles on the microstructure and thermal properties OF Sn-0.7Cu solder alloys
dc.typeconferenceObject
dc.type.versionpublishedVersion

Files

Original bundle
Now showing 1 - 1 of 1
Thumbnail Image
Name:
Nedeljkovic et al. - IOC24.pdf
Size:
4 MB
Format:
Adobe Portable Document Format
Download

Collections

NIR