Microstructures and wettability behavior of Sn-0.7Cu solder doped with graphene nanosheets

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dc.citation.epage433
dc.citation.rankM33
dc.citation.spage430
dc.contributor.authorNedeljković, Milan
dc.contributor.authorMladenović, Srba
dc.contributor.authorĆosović, Vladan
dc.contributor.authorMarković, Ivana
dc.contributor.authorPetrović, Jasmina
dc.contributor.authorStamenković, Uroš
dc.contributor.authorMitrović, Milijana
dc.contributor.authorKovačević, Avram
dc.date.accessioned2025-11-25T12:32:27Z
dc.date.available2025-11-25T12:32:27Z
dc.date.issued2025
dc.description.abstractThe effect of graphene nanosheets (GNS) on the wettability and microstructure of Sn-0.7Cu-xGNS (x = 0,0.02, 0.04, 0.06, 0.08, and 0.1 wt.%) nanocomposite solders was investigated. The composites were produced using the powder metallurgy (PM) technique. The microstructures of the solder joints between the solders and copper substrates were examined using a scanning electron microscope (SEM), and the presence of intermetallic compounds (IMCs) was confirmed by energy-dispersive spectroscopy (EDS). The thickness of the intermetallic layer formed at the solder/Cu interface was reduced by 64.6% with the addition of up to 0.1 wt.% GNS, compared to the Sn-0.7Cu base solder. The wettability of the samples was evaluated by measuring the spreading area of the solders on the copper substrates. The results showed that the addition of up to 0.1 wt.% GNS significantly improved wettability, as evidenced by a 95.2% increase in spreading area compared to the unreinforced solder.
dc.identifier.doi10.5937/IOC25430N
dc.identifier.isbn978-86-6305-164-5
dc.identifier.urihttps://ioc.tfbor.bg.ac.rs/public/2025/Proceedings_IOC_2025.pdf
dc.identifier.urihttps://repozitorijum.tfbor.bg.ac.rs/handle/123456789/6015
dc.language.isoen
dc.publisherUniversity of Belgrade - Technical Faculty in Bor
dc.rights.licenseCC-BY-NC-ND
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/4.0/
dc.sourceProceedings [Elektronski izvor] - 56th International October Conference on Mining and Metallurgy - IOC 2025, 22-25 October, 2025, Bor Lake, Serbia
dc.subjectpowder metallurgy
dc.subjectnanocomposite
dc.subjectgraphene nanosheets
dc.subjectintermetallic compounds
dc.titleMicrostructures and wettability behavior of Sn-0.7Cu solder doped with graphene nanosheets
dc.typeconferenceObject
dc.type.versionpublishedVersion

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